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3DIC
2009
IEEE
279views Hardware» more  3DIC 2009»
15 years 11 months ago
Compact modelling of Through-Silicon Vias (TSVs) in three-dimensional (3-D) integrated circuits
Abstract—Modeling parasitic parameters of Through-SiliconVia (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circ...
Roshan Weerasekera, Matt Grange, Dinesh Pamunuwa, ...
MCS
2009
Springer
15 years 11 months ago
Ensemble Based Data Fusion for Gene Function Prediction
The availability of an ever increasing amount of data sources due to recent advances in high throughput biotechnologies opens unprecedented opportunities for genome-wide gene funct...
Matteo Re, Giorgio Valentini
ICASSP
2009
IEEE
15 years 11 months ago
Genre effects on automatic sentence segmentation of speech: A comparison of broadcast news and broadcast conversations
We investigate genre effects on the task of automatic sentence segmentation, focusing on two important domains – broadcast news (BN) and broadcast conversation (BC). We employ a...
Jáchym Kolár, Yang Liu, Elizabeth Sh...
108
Voted
INFOCOM
2009
IEEE
15 years 10 months ago
CPM: Adaptive Video-on-Demand with Cooperative Peer Assists and Multicast
—We present CPM, a unified approach that exploits server multicast, assisted by peer downloads, to provide efficient video-on-demand (VoD) in a service provider environment. We...
Vijay Gopalakrishnan, Samrat Bhattacharjee, K. K. ...
144
Voted
ADHOCNETS
2009
Springer
15 years 10 months ago
Building Intrusion Detection with a Wireless Sensor Network
Abstract. This paper addresses the detection and reporting of abnormal building access with a wireless sensor network. A common office room, offering space for two working persons...
Markus Wälchli, Torsten Braun