— The increasing viability of three dimensional (3D) silicon integration technology has opened new opportunities for chip architecture innovations. One direction is in the extens...
Advances in the creation of computational materials are transforming our thinking about relations between the physical and digital. In this paper we characterize this transformati...
On Chip Multiprocessors (CMP), it is common that multiple cores share certain levels of cache. The sharing increases the contention in cache and memory-to-chip bandwidth, further h...
Yunlian Jiang, Eddy Z. Zhang, Kai Tian, Xipeng She...
In processors with several levels of hardware resource sharing, like CMPs in which each core is an SMT, the scheduling process becomes more complex than in processors with a singl...
Petar Radojkovic, Vladimir Cakarevic, Javier Verd&...
Abstract— We present a measurement-parameterized performance study of deployment factors in wireless mesh networks using three performance metrics: client coverage area, backhaul...