192 search results - page 18 / 39 » Fair Package Assignment |
ICCAD
2008
IEEE
14 years 3 months ago
2008
IEEE
— The area-I/O flip-chip package provides a high chip-density solution to the demand of more I/O’s in VLSI designs; it can achieve smaller package size, shorter wirelength, an...
MOBICOM
2006
ACM
14 years 2 months ago
2006
ACM
Wireless 802.11 hotspots have grown in an uncoordinated fashion with highly variable deployment densities. Such uncoordinated deployments, coupled with the difficulty of implemen...
PERCOM
2008
ACM
14 years 8 months ago
2008
ACM
Wireless sensor networks are commonly used to monitor and control the physical world. To provide a meaningful service such as disaster and emergency surveillance, meeting real-tim...
INFOCOM
2007
IEEE
14 years 2 months ago
2007
IEEE
Abstract— In wireless mesh networks, the end-to-end throughput of traffic flows depends on the path length, i.e. the higher the number of hops, the lower becomes the throughput...
TWC
2008
13 years 8 months ago
2008
To provide a near-optimal low-complexity solution to parallel multiuser scheduling in code-division multiple-access (CDMA), we propose generalized selection multiuser diversity (GS...