Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
: Recent years have seen significant research in finding closed form expressions for the delay of an RC circuit that improves upon the Elmore delay model. However, several of these...
Chandramouli V. Kashyap, Charles J. Alpert, Frank ...
In this paper, we present a new multi-packing tree (MP-tree) representation for macro placement to handle mixed-size designs. Based on binary trees, the MP-tree is very efficient,...
The routing channels of an FPGA consist of wire segments of various types providing the tradeoff between performance and routability. In the routing architectures of recently dev...
Seokjin Lee, Hua Xiang, D. F. Wong, Richard Y. Sun
The multilevel placement package mPL6 combines improved implementations of the global placer mPL5 (ISPD05) and the XDP legalizer and detailed placer (ASPDAC06). It consistently pr...
Tony F. Chan, Jason Cong, Joseph R. Shinnerl, Kent...