2 search results - page 1 / 1 » Fine-grain thermal profiling and sensor insertion for FPGAs |
184
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ISCAS
2006
IEEE
16 years 23 days ago
2006
IEEE
– Increasing logic densities and clock frequencies on FPGAs lead to rapid increase in power density, which translates to higher on-chip temperature. In this paper, we investigate...
159
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FPL
1997
Springer
15 years 11 months ago
1997
Springer
In this paper, a temperature-to-frequency transducer suitable for thermal monitoring on FPGAs is presented. The dependence between delay and temperature is used to produce a freque...