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ICCAD
2009
IEEE
154views Hardware» more  ICCAD 2009»
13 years 5 months ago
Pad assignment for die-stacking System-in-Package design
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
JSS
2011
106views more  JSS 2011»
12 years 10 months ago
A family of implementation-friendly BN elliptic curves
For the last decade, elliptic curve cryptography has gained increasing interest in industry and in the academic community. This is especially due to the high level of security it p...
C. C. F. Pereira Geovandro, Marcos A. Simplí...
IACR
2011
136views more  IACR 2011»
12 years 7 months ago
Trapdoors for Lattices: Simpler, Tighter, Faster, Smaller
We give new methods for generating and using “strong trapdoors” in cryptographic lattices, which are simultaneously simple, efficient, easy to implement (even in parallel), a...
Daniele Micciancio, Chris Peikert
ICPPW
2007
IEEE
14 years 2 months ago
Power Management of Multicore Multiple Voltage Embedded Systems by Task Scheduling
We study the role of task-level scheduling in power management on multicore multiple voltage embedded systems. Multicore on-achip, in particular DSP systems, can greatly improve p...
Gang Qu
SSD
2007
Springer
171views Database» more  SSD 2007»
14 years 2 months ago
Transformation of Continuous Aggregation Join Queries over Data Streams
We address continuously processing an aggregation join query over data streams. Queries of this type involve both join and aggregation operations, with windows specified on join ...
Tri Minh Tran, Byung Suk Lee