Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
For the last decade, elliptic curve cryptography has gained increasing interest in industry and in the academic community. This is especially due to the high level of security it p...
C. C. F. Pereira Geovandro, Marcos A. Simplí...
We give new methods for generating and using “strong trapdoors” in cryptographic lattices, which are simultaneously simple, efficient, easy to implement (even in parallel), a...
We study the role of task-level scheduling in power management on multicore multiple voltage embedded systems. Multicore on-achip, in particular DSP systems, can greatly improve p...
We address continuously processing an aggregation join query over data streams. Queries of this type involve both join and aggregation operations, with windows specified on join ...