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DAC
2012
ACM
13 years 8 months ago
Analysis of DC current crowding in through-silicon-vias and its impact on power integrity in 3D ICs
Due to the large geometry of through-silicon-vias (TSVs) and their connections to the power grid, significant current crowding can occur in 3D ICs. Prior works model TSVs and pow...
Xin Zhao, Michael Scheuermann, Sung Kyu Lim
TSP
2010
15 years 28 days ago
Optimization and analysis of distributed averaging with short node memory
Distributed averaging describes a class of network algorithms for the decentralized computation of aggregate statistics. Initially, each node has a scalar data value, and the goal...
Boris N. Oreshkin, Mark Coates, Michael G. Rabbat
ALGOSENSORS
2009
Springer
16 years 26 days ago
A Note on Uniform Power Connectivity in the SINR Model
In this paper we study the connectivity problem for wireless networks under the Signal to Interference plus Noise Ratio (SINR) model. Given a set of radio transmitters distributed ...
Chen Avin, Zvi Lotker, Francesco Pasquale, Yvonne ...
BMCBI
2006
111views more  BMCBI 2006»
15 years 6 months ago
High throughput profile-profile based fold recognition for the entire human proteome
Background: In order to maintain the most comprehensive structural annotation databases we must carry out regular updates for each proteome using the latest profile-profile fold r...
Liam J. McGuffin, Richard T. Smith, Kevin Bryson, ...
EENERGY
2010
15 years 10 months ago
ICT for green: how computers can help us to conserve energy
Information and communication technology (ICT) consumes energy, but is also an important means of conserving energy. Conventionally, it has done so by optimizing the performance o...
Friedemann Mattern, Thorsten Staake, Markus Weiss