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HPCA
2000
IEEE
14 years 1 months ago
Impact of Chip-Level Integration on Performance of OLTP Workloads
With increasing chip densities, future microprocessor designs have the opportunity to integrate many of the traditional systemlevel modules onto the same chip as the processor. So...
Luiz André Barroso, Kourosh Gharachorloo, A...
COMCOM
1998
132views more  COMCOM 1998»
13 years 8 months ago
A distributed object platform infrastructure for multimedia applications
Although distributed object computing has developed rapidly over the past decade, and is now becoming commercially important, there remain key application areas inadequately suppo...
Geoff Coulson, Michael Clarke
INFOCOM
2007
IEEE
14 years 3 months ago
Dynamic Cross-Layer Association in 802.11-Based Mesh Networks
—In IEEE 802.11-based wireless mesh networks a user is associated with an access point (AP) in order to communicate and be part of the overall network. The association mechanism ...
George Athanasiou, Thanasis Korakis, Özgü...
SECON
2007
IEEE
14 years 3 months ago
A SoC-based Sensor Node: Evaluation of RETOS-enabled CC2430
—Recent progress in Wireless Sensor Networks technology has enabled many complicated real-world applications. Some of the applications demand a non-trivial amount of computation;...
Sukwon Choi, Hojung Cha, SungChil Cho
OOPSLA
2009
Springer
14 years 3 months ago
Scalable nonblocking concurrent objects for mission critical code
The high degree of complexity and autonomy of future robotic space missions, such as Mars Science Laboratory (MSL), poses serious challenges in assuring their reliability and efï¬...
Damian Dechev, Bjarne Stroustrup