In double patterning lithography (DPL), coloring conflict and stitch minimization are the two main challenges. Post layout decomposition algorithm [1] [2]may not be enough to achi...
The flip-chip package provides a high chip-density solution to the demand for more I/O pads of VLSI designs. In this paper, we present the first routing algorithm in the literatur...
With increasing time-to-market pressure and shortening semiconductor product cycles, more and more chips are being designed with library-based methodologies. In spite of this shif...
Static analysis tools report software defects that may or may not be detected by other verification methods. Two challenges complicating the adoption of these tools are spurious f...
Joseph R. Ruthruff, John Penix, J. David Morgentha...
Security is a very important issue in information processing, especially in open network environments like the Internet. The Common Criteria (CC) is the standard requirements cata...
Monika Vetterling, Guido Wimmel, Alexander K. Wi&s...