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SLIP
2009
ACM
14 years 1 months ago
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim
CODES
2007
IEEE
14 years 1 months ago
A data protection unit for NoC-based architectures
Security is gaining increasing relevance in the development of embedded devices. Towards a secure system at each level of design, this paper addresses the security aspects related...
Leandro Fiorin, Gianluca Palermo, Slobodan Lukovic...
GLOBECOM
2007
IEEE
14 years 1 months ago
Optimizing P2P Streaming Throughput Under Peer Churning
Abstract— High-throughput P2P streaming relies on peer selection, the strategy a peer uses to select other peer(s) as its parent(s) of streaming. Although this problem has been t...
Yi Cui, Liang Dai, Yuan Xue
HICSS
2007
IEEE
111views Biometrics» more  HICSS 2007»
14 years 1 months ago
A Theoretical Perspective on Effective Interorganizational Knowledge
Interorganizational knowledge sharing is critical to knowledge intensive collaborations between organizations. Despite a proliferation of literature on knowledge sharing, most stu...
Nongkran Lertpittayapoom, Souren Paul, Peter P. My...
GCC
2007
Springer
14 years 1 months ago
Quality of Service of Grid Computing: Resource Sharing
Rapid advancement of communication technology has changed the landscape of computing. New models of computing, such as business-on-demand, Web services, peer-to-peer networks, and...
Xian-He Sun, Ming Wu