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ICCAD
2010
IEEE
13 years 5 months ago
2010
IEEE
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
ECOOPW
1998
Springer
14 years 2 hour ago
1998
Springer
The need for comparison between AOP and related approaches has been retained as a key issue in MLTK97 . We have noticed strong similarities between AOP and some object-oriented ap...
JSS
2008
13 years 7 months ago
2008
In this paper we discuss why and how measures related to human aspects should be incorporated into software development processes. This perspective is based on the vast evidence t...
CHI
2011
ACM
12 years 11 months ago
2011
ACM
In this paper we investigate how people use online rating information to inform decision making. We examine whether a theory of searching for information to discriminate between a...
SRDS
2006
IEEE
14 years 1 months ago
2006
IEEE
In order to safeguard a sensitive database, we must ensure both its privacy and its longevity. However, privacy and longevity tend to be competing objectives. We show how to desig...