Technology scaling trends and the limitations of packaging and cooling have intensified the need for thermally efficient architectures and architecture-level temperature managemen...
Eren Kursun, Glenn Reinman, Suleyman Sair, Anahita...
—The sustained push for performance, transistor count, and instruction level parallelism has reached a point where chip level power density issues are at the forefront of design ...
Dynamic Thermal Management (DTM) techniques have been proposed to save on thermal packaging and cooling costs for generalpurpose processors. However, when invoked, these technique...
Thermal management is critical for clusters because of the increasing power consumption of modern processors, compact server architectures and growing server density in data center...
We have previously presented Qsilver, a flexible simulation system for graphics architectures. In this paper we describe our extensions to this system, which we use— instrument...
Jeremy W. Sheaffer, Kevin Skadron, David P. Luebke