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TCAD
2008
114views more  TCAD 2008»
13 years 8 months ago
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
CDVE
2007
Springer
124views Visualization» more  CDVE 2007»
14 years 2 months ago
"Integrare", a Collaborative Environment for Behavior-Oriented Design
In order to build complex, large-scale, dependable systems it is necessary to use a development environment with an integrated set of capabilities that supports editing and formal...
Lian Wen, Robert Colvin, Kai Lin, John Seagrott, N...
ACMDIS
2004
ACM
14 years 1 months ago
The information discovery framework
This paper continues the movement from technology centered to human centered approaches in the study of tasks that involve finding, understanding, and using information, and tools...
Andruid Kerne, Steven M. Smith
VRST
2009
ACM
14 years 3 months ago
Standalone edge-based markerless tracking of fully 3-dimensional objects for handheld augmented reality
This paper presents a markerless tracking technique targeted to the Windows Mobile Pocket PC platform. The primary aim of this work is to allow the development of standalone augme...
João Paulo S. M. Lima, Veronica Teichrieb, ...
ATAL
2005
Springer
14 years 2 months ago
An agent-based approach for managing symbiotic simulation of semiconductor assembly and test operation
The rapid changing business environment of high-tech asset intensive enterprises such as semiconductor manufacturing constantly drives production managers to look for better solut...
Malcolm Yoke-Hean Low, Kong Wei Lye, Peter Lenderm...