—The ongoing move to chip multiprocessors (CMPs) permits greater sharing of last-level cache by processor cores but this sharing aggravates the cache contention problem, potentia...
Chi Xu, Xi Chen, Robert P. Dick, Zhuoqing Morley M...
Real-time Garbage Collection (RTGC) has recently advanced to the point where it is being used in production for financial trading, military command-and-control, and telecommunicat...
Joshua S. Auerbach, David F. Bacon, Perry Cheng, D...
— With the increasing reliance of complex real-world applications on composite web services assembled from independently developed component services, there is a growing need for...
Hongyu Sun, Samik Basu, Vasant Honavar, Robyn R. L...
This paper shows how to quickly move the state of a running computer across a network, including the state in its disks, memory, CPU registers, and I/O devices. We call this state...
Constantine P. Sapuntzakis, Ramesh Chandra, Ben Pf...
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...