— The increasing viability of three dimensional (3D) silicon integration technology has opened new opportunities for chip architecture innovations. One direction is in the extens...
Abstract— We address the problem of identifying high throughput paths in 802.11 wireless mesh networks. We introduce an analytical model that accurately captures the 802.11 MAC p...
Theodoros Salonidis, Michele Garetto, A. Saha, Edw...
—This paper deals with the topology formation schemes in the IEEE 802.11 based wireless mesh network. The recent standardization effort for specifying a wireless distribution sys...
—A major barrier for the adoption of wireless mesh networks is severe limits on throughput. Many in-network packet mixing techniques at the network layer [1], [2], [3] as well as...
Richard Alimi, Erran L. Li, Ramachandran Ramjee, H...