816 search results - page 112 / 164 » Interconnect design methods for memory design |
ISPASS
2007
IEEE
14 years 1 months ago
2007
IEEE
— The design trend towards CMPs has made the simulation of multiprocessor systems a necessity and has also made multiprocessor systems widely available. While a serial multiproce...
BMCBI
2011
12 years 11 months ago
2011
Background: Graphical models of network associations are useful for both visualizing and integrating multiple types of association data. Identifying modules, or groups of function...
MICRO
2006
IEEE
14 years 1 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
RSP
2000
IEEE
14 years 1 days ago
2000
IEEE
Dataflow programming has proven to be popular for representing applications in rapid prototyping tools for digital signal processing (DSP); however, existing dataflow design tools...
VLDB
1998
ACM
13 years 12 months ago
1998
ACM
The increasing performance and decreasing cost of processors and memory are causing system intelligence to move into peripherals from the CPU. Storage system designers are using t...