Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Content classification performed by end users is spreading through the web. Most of the work done so far is related to the hypermedia web. In spite of that, there is a growing mas...
This paper presents a case study of interdisciplinary collaboration in building a set of tools to simulate and visualize airflow around bat wings during flight. A motion capture sy...
Igor Pivkin, Eduardo Hueso, R. Weinstein, David H....
— Data collection using Autonomous Underwater Vehicles (AUVs) is increasing in importance within the oceanographic research community. Contrary to traditional moored or static pl...
Ryan N. Smith, Arvind Pereira, Yi Chao, Peggy Li, ...