108 search results - page 20 / 22 » Introspective 3D chips |
ICC
2007
IEEE
14 years 1 months ago
2007
IEEE
— This paper deals with the orthogonality factor, a transfer coefficient which allows the transformation of a transmitted orthogonal signal into a received Gaussian noise to be ...
DATE
2006
IEEE
14 years 1 months ago
2006
IEEE
Power distribution and signal transmission are becoming key limiters for chip performance in nanometer era. These issues can be simultaneously addressed by designing transmission ...
ICRA
2003
IEEE
14 years 25 days ago
2003
IEEE
The forms of communication available now are categorized into the one or three dimensional. One dimensional communication includes metal wires and optical fibers in which the elec...
HPCA
1996
IEEE
13 years 11 months ago
1996
IEEE
The current multiprocessors such asCray T3D support interprocessor communication using partitioned dimension-order routers (PDRs). In a PDR implementation, the routing logic and sw...
ASPDAC
2008
ACM
13 years 9 months ago
2008
ACM
The capability of predicting the temperature profile is critically important for timing estimation, leakage reduction, power estimation, hotspot avoidance and reliability concerns ...