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LUT-based FPGA technology mapping for reliability
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A Comprehensive Layout Methodology and Layout-Specific Circuit Analyses for Three-Dimensional Integrated Circuits
14 years 1 months ago
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In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit ar...
Syed M. Alam, Donald E. Troxel, Carl V. Thompson
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