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CODES
2007
IEEE
14 years 4 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
CODES
2007
IEEE
14 years 4 months ago
Performance modeling for early analysis of multi-core systems
Performance analysis of microprocessors is a critical step in defining the microarchitecture, prior to register-transfer-level (RTL) design. In complex chip multiprocessor systems...
Reinaldo A. Bergamaschi, Indira Nair, Gero Dittman...
CODES
2007
IEEE
14 years 4 months ago
A code-generator generator for multi-output instructions
We address the problem of instruction selection for Multi-Output Instructions (MOIs), producing more than one result. Such inherently parallel hardware instructions are very commo...
Hanno Scharwächter, Jonghee M. Youn, Rainer L...
CCS
2007
ACM
14 years 3 months ago
Multi-module vulnerability analysis of web-based applications
In recent years, web applications have become tremendously popular, and nowadays they are routinely used in security-critical environments, such as medical, financial, and milita...
Davide Balzarotti, Marco Cova, Viktoria Felmetsger...
EMSOFT
2007
Springer
14 years 3 months ago
Exploiting non-volatile RAM to enhance flash file system performance
Non-volatile RAM (NVRAM) such as PRAM (Phase-change RAM), FeRAM (Ferroelectric RAM), and MRAM (Magnetoresistive RAM) has characteristics of both non-volatile storage and random ac...
In Hwan Doh, Jongmoo Choi, Donghee Lee, Sam H. Noh
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