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ASPDAC
2011
ACM
297views Hardware» more  ASPDAC 2011»
12 years 11 months ago
CELONCEL: Effective design technique for 3-D monolithic integration targeting high performance integrated circuits
3-D monolithic integration (3DMI), also termed as sequential integration, is a potential technology for future gigascale circuits. Since the device layers are processed in sequent...
Shashikanth Bobba, Ashutosh Chakraborty, Olivier T...
IFIP
1993
Springer
13 years 11 months ago
Computer-Aided Manufacturing System Engineering
A new type of computer-aided engineering environment is envisioned which will improve the productivity of manufacturing/industrial engineers. This environment would be used by eng...
C. R. McLean
ACSC
2006
IEEE
14 years 1 months ago
Modelling layer 2 and layer 3 device bandwidths using B-node theory
Modern computer networks contain an amalgamation of devices and technologies, with the performance exhibited by each central to digital communications. Varieties of methods exist ...
S. Cikara, Stanislaw P. Maj, David T. Shaw
WWW
2004
ACM
14 years 8 months ago
Service Model for Collaborating Distributed Design and Manufacturing
This paper presents a Service-Oriented Process Model (SOM) to build a web-services based process management system, called MIDAS that would support distributed Design and Manufact...
Moon-Jung Chung, Woongsup Kim, Ravi Gopalan, Hong ...
ISTA
2007
13 years 9 months ago
Integrating Manufacturing System Simulation Development A methodological framework
: Today, discrete-event simulation (DES) use in the manufacturing industry has become widespread, but far from all companies use this technology.Often simulation is used on a `one-...
Jamal Mtaawa, Zidan Basher