1295 search results - page 79 / 259 » Layered manufacturing technologies |
ETFA
2006
IEEE
14 years 3 months ago
2006
IEEE
—The International Electro-technical Commission through the 61499 standard establishes the basic infrastructure towards an open market in the control and automation domain. This ...
CEEMAS
2003
Springer
14 years 2 months ago
2003
Springer
Flexibility and adaptability are essential properties of intelligent manufacturing systems. However, it is a major challenge to realize these properties and the benefits of a flexi...
DELTA
2002
IEEE
14 years 2 months ago
2002
IEEE
Teaching the practical aspects of device and chip design in New Zealand presents many problems, including high manufacturing costs, long lead times, and the lack of local industry...
DAC
1994
ACM
14 years 1 months ago
1994
ACM
Today's high-performance single-chip CMOS microprocessors are the most complex and challenging chip designs ever implemented. To stay on the leading edge, Digital's micro...
APNOMS
2007
Springer
14 years 1 months ago
2007
Springer
The mobile devices have gained much functionality and intelligence with the growth of network technologies, the abundance of network resources, and the increase of various services...