1295 search results - page 81 / 259 » Layered manufacturing technologies |
JCP
2008
13 years 9 months ago
2008
Semiconductor manufacturing process scaling increases leakage and transistor variations, both of which are problematic for static random access memory (SRAM). Since SRAM is a criti...
DSS
2007
13 years 9 months ago
2007
Compared with the traditional sequential design method, concurrent engineering is a systematic approach to integrate concurrent design of products and their related processes. One...
IVC
2007
13 years 9 months ago
2007
ct 7 An increasingly frequent application of Machine Vision technologies is in automated surface inspection for the detection of defects in 8 manufactured products. Such systems oï...
ATS
2010
IEEE
13 years 5 months ago
2010
IEEE
Systems with many integrated circuits (ICs), often of the same type, are increasingly common to meet the constant performance demand. However, systems in recent semiconductor techn...
DIM
2006
ACM
14 years 3 months ago
2006
ACM
With the advancement in user-centric and URI-based identity systems over the past two years, it has become clear that a single specification will not be the solution to all proble...