Technology scaling trends and the limitations of packaging and cooling have intensified the need for thermally efficient architectures and architecture-level temperature managemen...
Eren Kursun, Glenn Reinman, Suleyman Sair, Anahita...
In this paper we present an efficient algorithm for extracting the complete statistical distribution of the input impedance of interconnect structures in the presence of a large n...
The numerical solution of linear systems with certain tensor product structures is considered. Such structures arise, for example, from the finite element discretization of a line...