Packaging costs of Micro-Electro-Mechanical System (MEMS) are still contributing with >50% to the total costs of most devices. Aligned wafer bonding techniques for Wafer-level ...
Herwig Kirchberger, Paul Lindler, Markus Wimplinge...
It is becoming more important to design systems capable of performing high-level management and control tasks in interactive dynamic environments. At the same time, it is difficul...
We present an auction-based approach to manufacturing control. Workpieces auction off their current task, while machines bid for tasks. When awarding a machine, a workpiece takes ...
–The accessibility of the World Wide Web and its flexibility for conveying digital information in various forms makes it a convenient mode of communication for education. In thi...
-- Aggressive CMOS scaling results in low threshold voltage and thin oxide thickness for transistors manufactured in deep submicron regime. As a result, reducing the subthreshold a...