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CORR
2008
Springer
84views Education» more  CORR 2008»
13 years 9 months ago
Novel Bonding technologies for wafer-level transparent packaging of MOEMS
Packaging costs of Micro-Electro-Mechanical System (MEMS) are still contributing with >50% to the total costs of most devices. Aligned wafer bonding techniques for Wafer-level ...
Herwig Kirchberger, Paul Lindler, Markus Wimplinge...
CATA
2003
13 years 11 months ago
A Restaurant Finder using Belief-Desire-Intention Agent Model and Java Technology
It is becoming more important to design systems capable of performing high-level management and control tasks in interactive dynamic environments. At the same time, it is difficul...
Dongqing Lin, Thomas P. Wiggen, Chang-Hyun Jo
ICMAS
2000
13 years 11 months ago
Self-Organizing Manufacturing Control: An Industrial Application of Agent Technology
We present an auction-based approach to manufacturing control. Workpieces auction off their current task, while machines bid for tasks. When awarding a machine, a workpiece takes ...
Stefan Bussmann, Klaus Schild
WEBNET
1997
13 years 11 months ago
Easy Ed: An Integration of Technologies for Multimedia Education
–The accessibility of the World Wide Web and its flexibility for conveying digital information in various forms makes it a convenient mode of communication for education. In thi...
Gulrukh Ahanger, Thomas D. C. Little
TVLSI
2008
197views more  TVLSI 2008»
13 years 9 months ago
Leakage Minimization of SRAM Cells in a Dual-Vt and Dual-Tox Technology
-- Aggressive CMOS scaling results in low threshold voltage and thin oxide thickness for transistors manufactured in deep submicron regime. As a result, reducing the subthreshold a...
Behnam Amelifard, Farzan Fallah, Massoud Pedram