— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
Young-Joon Lee, Yoon Jo Kim, Gang Huang, Muhannad ...
Fault-tolerant architectures based on physical replication of components are vulnerable to faults that cause the same effect in all replica. Short outages in a power supply shared...
Critical infrastructures like the power grid are essentially physical processes controlled by electronic devices. In the last decades, these electronic devices started to be contr...
Paulo Sousa, Alysson Neves Bessani, Wagner Saback ...
—In the future smart city, new information and communication technologies will enable a better management of the available resources. The future smart grid infrastructure is emer...
Abstract. A team of mobile sensors can be used for coverage of targets in different environments. The dynamic nature of such an application requires the team of agents to adjust th...