2749 search results - page 466 / 550 » Manufacturing-Aware Physical Design |
DATE
2009
IEEE
14 years 3 months ago
2009
IEEE
— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
DSN
2009
IEEE
14 years 3 months ago
2009
IEEE
Fault-tolerant architectures based on physical replication of components are vulnerable to faults that cause the same effect in all replica. Short outages in a power supply shared...
DSN
2009
IEEE
14 years 3 months ago
2009
IEEE
Critical infrastructures like the power grid are essentially physical processes controlled by electronic devices. In the last decades, these electronic devices started to be contr...
EMS
2009
IEEE
14 years 3 months ago
2009
IEEE
—In the future smart city, new information and communication technologies will enable a better management of the available resources. The future smart grid infrastructure is emer...
IAT
2009
IEEE
14 years 3 months ago
2009
IEEE
Abstract. A team of mobile sensors can be used for coverage of targets in different environments. The dynamic nature of such an application requires the team of agents to adjust th...