2749 search results - page 92 / 550 » Manufacturing-Aware Physical Design |
ASPDAC
2012
ACM
12 years 5 months ago
2012
ACM
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
HRI
2010
ACM
14 years 4 months ago
2010
ACM
—When a user is in close proximity to a robot, physical contact becomes a potentially valuable channel for communication. People often use direct physical contact to guide a pers...
EDBT
2010
ACM
14 years 3 months ago
2010
ACM
The creation of a generic and modular query optimization and processing infrastructure can provide significant benefits to XML data management. Key pieces of such an infrastructur...
CANDT
2009
14 years 1 months ago
2009
The role of material artefacts in supporting distributed and colocated work practices has been well acknowledged within HCI and CSCW research. In this paper, we show that in addit...
OHS
2000
Springer
14 years 1 months ago
2000
Springer
There has been tremendous growth in electronic commerce over the past few years. This growth is expected to sustain momentum in the future. Hence, the Internet has become an essent...