325 search results - page 33 / 65 » Maximum margin planning |
SLIP
2009
ACM
14 years 2 months ago
2009
ACM
As technology advances, 3D ICs are introduced for alleviating the interconnect problem coming with shrinking feature size and increasing integration density. In 3D ICs, one of the...
DATE
2009
IEEE
14 years 2 months ago
2009
IEEE
Abstract—This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked silicon integrated circuits (ICs). The 3D power distribution network is modele...
RTSS
2007
IEEE
14 years 2 months ago
2007
IEEE
Recent research shows that significant energy saving can be achieved in wireless sensor networks by using mobile elements (MEs) capable of carrying data mechanically. However, th...
TMC
2008
13 years 7 months ago
2008
Recent research shows that significant energy saving can be achieved in wireless sensor networks by using mobile elements (MEs) capable of carrying data mechanically. However, the ...
EDBT
2006
ACM
14 years 7 months ago
2006
ACM
Navigational queries on Web-accessible life science sources pose unique query optimization challenges. The objects in these sources are interconnected to objects in other sources, ...