The main goal of this paper is to develop deeper insights into viable placement-level optimization of routing. Two primary contributions are made. First, an experimental framework...
— The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wirelength. However, wire congestion and thermal issues are exacerbated d...
Abstract -- Shortest path routing protocols may suffer from congestion due to the use of a single shortest path between a source and a destination. The goal of our work is to first...
Three-dimensional integrated circuits (3D ICs) provide an attractive solution for improving circuit performance. Such solutions must be embedded in an electrothermally-conscious d...
To handle modern routing with nanometer effects, we need to consider designs of variable wire widths and spacings, for which gridless routers are desirable due to their great fle...