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» Measuring routing congestion for multi-layer global routing
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ICCAD
2004
IEEE
260views Hardware» more  ICCAD 2004»
14 years 4 months ago
On interactions between routing and detailed placement
The main goal of this paper is to develop deeper insights into viable placement-level optimization of routing. Two primary contributions are made. First, an experimental framework...
Devang Jariwala, John Lillis
ASPDAC
2005
ACM
134views Hardware» more  ASPDAC 2005»
14 years 1 months ago
Wire congestion and thermal aware 3D global placement
— The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wirelength. However, wire congestion and thermal issues are exacerbated d...
Karthik Balakrishnan, Vidit Nanda, Siddharth Easwa...
INFOCOM
2003
IEEE
14 years 27 days ago
An approach to alleviate link overload as observed on an IP backbone
Abstract -- Shortest path routing protocols may suffer from congestion due to the use of a single shortest path between a source and a destination. The goal of our work is to first...
Sundar Iyer, Supratik Bhattacharyya, Nina Taft, Ch...
ASPDAC
2006
ACM
166views Hardware» more  ASPDAC 2006»
14 years 1 months ago
Temperature-aware routing in 3D ICs
Three-dimensional integrated circuits (3D ICs) provide an attractive solution for improving circuit performance. Such solutions must be embedded in an electrothermally-conscious d...
Tianpei Zhang, Yong Zhan, Sachin S. Sapatnekar
ASPDAC
2005
ACM
65views Hardware» more  ASPDAC 2005»
14 years 1 months ago
Multilevel full-chip gridless routing considering optical proximity correction
To handle modern routing with nanometer effects, we need to consider designs of variable wire widths and spacings, for which gridless routers are desirable due to their great fle...
Tai-Chen Chen, Yao-Wen Chang