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134
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ICCAD
2009
IEEE
15 years 1 months ago
2009
IEEE
Pre-bond testing of 3D stacked ICs involves testing individual dies before bonding. The overall yield of 3D ICs improves with prebond testability because designers can avoid stack...
173
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IAJIT
2010
15 years 1 months ago
2010
: Finite Radon Transform mapper has the ability to increase orthogonality of sub-carriers, it is non sensitive to channel parameters variations, and has a small constellation energ...
165
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ADHOC
2011
2011
RadiaLE: A framework for designing and assessing link quality estimators in wireless sensor networks
14 years 7 months ago
—Stringent cost and energy constraints impose the use of low-cost and low-power radio transceivers in large-scale wireless sensor networks (WSNs). This fact, together with the ha...
198
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ASPDAC
2011
ACM
14 years 7 months ago
2011
ACM
3-D monolithic integration (3DMI), also termed as sequential integration, is a potential technology for future gigascale circuits. Since the device layers are processed in sequent...
138
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ASPDAC
2011
ACM
14 years 7 months ago
2011
ACM
- In low temperature polycrystalline silicon (LTPS) based display technologies, the electrical parameter variations in thin film transistors (TFTs) caused by random grain boundarie...