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CORR
2010
Springer
15 years 4 months ago
2010
Springer
113
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CORR
2008
Springer
15 years 4 months ago
2008
Springer
A novel fabrication process, which uses wafer transfer and micro-electroplating technique, has been proposed and tested. In this paper, the effects of the diaphragm thickness and s...
106
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CORR
2010
Springer
15 years 4 months ago
2010
Springer
In this paper we tried to focus on some of the problems with the mobile keypad and text entering in these devices, and tried to give some possible suggestions. We mainly took some...