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ICCAD
2010
IEEE
13 years 8 months ago
2010
IEEE
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
ICCAD
2010
IEEE
13 years 8 months ago
2010
IEEE
1In this paper, we will present an effective layout method for analog circuits. We consider symmetry constraint, common centroid constraint, device merging and device clustering du...
MOBILIGHT
2010
13 years 7 months ago
2010
Abstract. This paper describes a framework for the design space exploration of resource-efficient software-defined radio architectures. This design space exploration is based on a ...
DPHOTO
2009
13 years 7 months ago
2009
Most digital cameras employ a spatial subsampling process, implemented as a color filter array (CFA), to capture color images. The choice of CFA patterns has a great impact on the...
GECCO
2009
Springer
13 years 7 months ago
2009
Springer
We describe the first steps in the adoption of Shape Grammars with Grammatical Evolution for application in Evolutionary Design. Combining the concepts of Shape Grammars and Genet...