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DATE
2009
IEEE
113views Hardware» more  DATE 2009»
14 years 2 months ago
System-level process variability analysis and mitigation for 3D MPSoCs
Abstract—While prior research has extensively evaluated the performance advantage of moving from a 2D to a 3D design style, the impact of process parameter variations on 3D desig...
Siddharth Garg, Diana Marculescu
WSC
2008
13 years 10 months ago
Identifying significant factors affecting Request For Information (RFI) process time
The research is to illustrate how to identify the significant factor(s) affecting the Request For Information (RFI) process cycle time in the context of queueing behavior. Among t...
Chang-sun Chin, Jeffrey S. Russell
DAC
2009
ACM
14 years 8 months ago
Dynamic thermal management via architectural adaptation
Exponentially rising cooling/packaging costs due to high power density call for architectural and software-level thermal management. Dynamic thermal management (DTM) techniques co...
Ramkumar Jayaseelan, Tulika Mitra
TVLSI
2008
126views more  TVLSI 2008»
13 years 7 months ago
Body Bias Voltage Computations for Process and Temperature Compensation
With continued scaling into the sub-90nm regime, the role of process, voltage and temperature (PVT) variations on the performance of VLSI circuits has become extremely important. T...
Sanjay V. Kumar, Chris H. Kim, Sachin S. Sapatneka...
ICIP
2005
IEEE
14 years 9 months ago
Stochastic frame buffers for rate distortion optimized loss resilient video communications
In this paper we propose an error control scheme for video communications over lossy channels. The proposed algorithm uses stochastic frame buffers(SFB) to determine the expected ...
Oztan Harmanci, A. Murat Tekalp