Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
Samson Melamed, Thorlindur Thorolfsson, Adi Sriniv...
Despite much research in the area of wireless sensor networks in recent years, the programming of sensor nodes is still time-consuming and tedious. A new paradigm which seems to b...
Christoph Reinke, Nils Hoeller, Jana Neumann, Sven...
Reference counting is a widely-used resource management idiom which maintains a count of references to each resource by incrementing the count upon an acquisition, and decrementing...
Michael Emmi, Ranjit Jhala, Eddie Kohler, Rupak Ma...
Abstract—Many embedded platforms consist of a heterogeneous collection of processing elements, memory modules, and communication subsystems. These components often implement diff...
Hennadiy Leontyev, Samarjit Chakraborty, James H. ...
Web service orchestration is popular because the application logic is defined from a central and unique point of view, but it suffers from scalability issues. In choreography, the ...