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HAPTICS
2005
IEEE
14 years 2 months ago
2005
IEEE
The Maxima Haptics Package is a free software package for symbolic analysis of linear models of haptic devices and teleoperators. From a mechanical model of the haptic device, the...
CODES
2010
IEEE
13 years 7 months ago
2010
IEEE
The impact of process variation in state of the art technology makes traditional (worst case) designs unnecessarily pessimistic, which translates to suboptimal designs in terms of...
KDD
2000
ACM
14 years 27 days ago
2000
ACM
We describe an application of data mining and decision analysis to the problem of die-level functional test in integrated circuit manufacturing. Integrated circuits are fabricated...
WSC
2004
13 years 10 months ago
2004
Wafers in a 300-mm semiconductor fabrication facility are transported throughout the factory in carriers called front opening unified pods (FOUPs). Two standard capacities of FOUP...
ISPA
2004
Springer
14 years 2 months ago
2004
Springer
HPL is a parallel Linpack benchmark package widely adopted in massive cluster system performance test. On HPL data layout among processors, a law to determine block size NB theoret...