5355 search results - page 147 / 1071 » Modules |
NEUROSCIENCE
2001
Springer
14 years 2 months ago
2001
Springer
SAS
2001
Springer
14 years 2 months ago
2001
Springer
ICCAD
2000
IEEE
14 years 2 months ago
2000
IEEE
IPPS
2000
IEEE
14 years 2 months ago
2000
IEEE
In this paper, we present a new packaging architecture for chip-level optical interconnections based on imaging fiber bundles. Imaging fiber bundles consist of densely packed arra...
IPPS
2000
IEEE
14 years 2 months ago
2000
IEEE
This paper proposes and demonstrates novel types of vision chips that utilize pulse trains for image processing. Two types of chips