2036 search results - page 343 / 408 » More on a model curriculum for modeling and simulation |
ISQED
2007
IEEE
14 years 1 months ago
2007
IEEE
Due to the roaring power dissipation and gaining popularity of 3D integration, thermal dissipation has been a critical concern of modern VLSI design. The availability for chip-lev...
ISVLSI
2007
IEEE
14 years 1 months ago
2007
IEEE
In sub-90nm technologies, more frequent hard faults pose a serious burden on processor design and yield control. In addition to manufacturing-time chip repair schemes, microarchit...
PRDC
2007
IEEE
14 years 1 months ago
2007
IEEE
We propose a comprehensive solution to handle memory-overflow problems in multitasking embedded systems thereby improving their reliability and availability. In particular, we pro...
VTC
2007
IEEE
14 years 1 months ago
2007
IEEE
Abstract— A well-known concept to adapt the transmitted payload to the current channel capacity is to perform segmentation of the uncoded user payload. In [1], a new cross layera...
CCS
2007
ACM
14 years 1 months ago
2007
ACM
We consider the effect attackers who disrupt anonymous communications have on the security of traditional high- and low-latency anonymous communication systems, as well as on the...