Within-die variation in leakage power consumption is substantial and increasing for chip-level multiprocessors (CMPs) and multiprocessor systems-on-chip. Dealing with this problem...
Lide Zhang, Lan S. Bai, Robert P. Dick, Li Shang, ...
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
With the growing popularity of information retrieval (IR) in distributed systems and in particular P2P Web search, a huge number of protocols and prototypes have been introduced i...
Thomas Neumann, Matthias Bender, Sebastian Michel,...
This paper describes the design and implementation of a framework designed to aid collaborative development of a digital musical instrument mapping layer1 . The goal was to create ...
Joseph Malloch, Stephen Sinclair, Marcelo M. Wande...
We apply an adapted version of Particle Swarm Optimization to distributed unsupervised robotic learning in groups of robots with only local information. The performance of the lea...