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CORR
2008
Springer
194views Education» more  CORR 2008»
13 years 7 months ago
Fabrication of 3D Packaging TSV using DRIE
Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch Through-Silicon Via (TSV) for advanced interconnections. The ...
M. Puech, Jean-Marc Thevenoud, J. M. Gruffat, N. L...
CSL
2008
Springer
13 years 7 months ago
A stopping criterion for active learning
Active learning (AL) is a framework that attempts to reduce the cost of annotating training material for statistical learning methods. While a lot of papers have been presented on...
Andreas Vlachos
EOR
2010
102views more  EOR 2010»
13 years 7 months ago
The Tree of Hubs Location Problem
The Tree-of-Hubs Location Problem is studied. This problem, which combines several aspects of some location, network design and routing problems, is inspired by those transportati...
Iván A. Contreras, Elena Fernández, ...
EOR
2010
110views more  EOR 2010»
13 years 7 months ago
Online scheduling policies for multiclass call centers with impatient customers
We consider a call center with two classes of impatient customers: premium and regular classes. Modeling our call center as a multiclass GI/GI/s + M queue, we focus on developing ...
Oualid Jouini, Auke Pot, Ger Koole, Yves Dallery
AUTOMATICA
2006
84views more  AUTOMATICA 2006»
13 years 7 months ago
Optimal control of LTI systems over unreliable communication links
In this paper, optimal control of linear time-invariant (LTI) systems over unreliable communication links is studied. The motivation of the problem comes from growing applications...
Orhan C. Imer, Serdar Yüksel, Tamer Basar