Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch Through-Silicon Via (TSV) for advanced interconnections. The ...
M. Puech, Jean-Marc Thevenoud, J. M. Gruffat, N. L...
Active learning (AL) is a framework that attempts to reduce the cost of annotating training material for statistical learning methods. While a lot of papers have been presented on...
The Tree-of-Hubs Location Problem is studied. This problem, which combines several aspects of some location, network design and routing problems, is inspired by those transportati...
We consider a call center with two classes of impatient customers: premium and regular classes. Modeling our call center as a multiclass GI/GI/s + M queue, we focus on developing ...
In this paper, optimal control of linear time-invariant (LTI) systems over unreliable communication links is studied. The motivation of the problem comes from growing applications...