Exponentially rising cooling/packaging costs due to high power density call for architectural and software-level thermal management. Dynamic thermal management (DTM) techniques co...
Long design cycles due to the inability to predict silicon realities is a well-known problem that plagues analog/RF integrated circuit product development. As this problem worsens...
A software system interacts with third-party libraries through various APIs. Using these library APIs often needs to follow certain usage patterns. Furthermore, ordering rules (sp...
Due to power wall, memory wall, and ILP wall, we are facing the end of ever increasing single-threaded performance. For this reason, multicore and manycore processors are arising ...
We explore the security of blind signatures under aborts where the user or the signer may stop the interactive signature issue protocol prematurely. Several works on blind signatur...