In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Ky...
Security incident management is one of the critical areas that offers valuable information to security experts, but still lacks much development. Currently, several security incide...
Meletis A. Belsis, Alkis Simitsis, Stefanos Gritza...
DCSP (Distributed Constraint Satisfaction Problem) has been a very important research area in AI (Artificial Intelligence). There are many application problems in distributed AI t...
The structure of customer communication network provides us a natural way to understand customers’ relationships. Traditional customer relationship management (CRM) methods focu...
The volume of mass unsolicited electronic mail, often known as spam, has recently increased enormously and has become a serious threat to not only the Internet but also to society...