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ICCAD
2010
IEEE
146views Hardware» more  ICCAD 2010»
15 years 1 months ago
Through-silicon-via management during 3D physical design: When to add and how many?
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Ky...
153
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PCI
2005
Springer
15 years 9 months ago
Workflow Based Security Incident Management
Security incident management is one of the critical areas that offers valuable information to security experts, but still lacks much development. Currently, several security incide...
Meletis A. Belsis, Alkis Simitsis, Stefanos Gritza...
94
Voted
CORR
2010
Springer
69views Education» more  CORR 2010»
15 years 3 months ago
Efficient Knowledge Base Management in DCSP
DCSP (Distributed Constraint Satisfaction Problem) has been a very important research area in AI (Artificial Intelligence). There are many application problems in distributed AI t...
Hong Jiang
CIKM
2009
Springer
15 years 10 months ago
Group CRM: a new telecom CRM framework from social network perspective
The structure of customer communication network provides us a natural way to understand customers’ relationships. Traditional customer relationship management (CRM) methods focu...
Bin Wu, Qi Ye, Shengqi Yang, Bai Wang
136
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SAINT
2005
IEEE
15 years 9 months ago
Memory Management of Density-Based Spam Detector
The volume of mass unsolicited electronic mail, often known as spam, has recently increased enormously and has become a serious threat to not only the Internet but also to society...
Kenichi Yoshida, Fuminori Adachi, Takashi Washio, ...