Light-weight, flexible access control, which allows software to regulate reads and writes to any granularity of memory region, can help improve the reliability of today’s multi...
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Mo...
We present a new technique for verification of complex hardware devices that allows both generality andahighdegreeofautomation.Thetechniqueisbasedonournewwayofconstructinga"li...
Sergey Berezin, Edmund M. Clarke, Armin Biere, Yun...
This paper considers a new approach that allows for the creation of typographic works through gestural interaction. It describes a prototype application called TextDraw, which is ...
Polar modulation techniques offer the capability of multimode wireless system and the potential for the high efficiency Power Amplifier (PA). This paper describes a new design of D...