3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
— In this paper, we describe a new approach for the extrinsic calibration of a camera with a 3D laser range finder, that can be done on the fly. This approach does not require an...
As the useful life expectancy of software continues to increase, the task of maintaining the source code has become the dominant phase of the software life-cycle. In order to impr...
Jason W. A. Selby, Fraser P. Ruffell, Mark Giesbre...
The TAC Supply Chain Management (TAC/SCM) game presents a challenging dynamic environment for autonomous decision-making in a salient application domain. Strategic interactions co...
Patrick R. Jordan, Christopher Kiekintveld, Michae...
This paper analyzes bilateral multi-issue negotiation between selfinterested autonomous agents. The agents have time constraints in the form of both deadlines and discount factors...
S. Shaheen Fatima, Michael Wooldridge, Nicholas R....