: Thermal issue is a critical challenge in 3D IC circuit design. Incorporating thermal vias into 3D IC is a promising way to mitigate thermal issues by lowering down the thermal re...
Abstract. This paper investigates symbolic heuristic search with BDDs for solving domain-independent action planning problems cost-optimally. By distributimpact of operators that t...
— Robust power distribution within available routing area resources is critical to chip performance and reliability. In this paper, we propose a novel and efficient method for o...
Hongyu Chen, Chung-Kuan Cheng, Andrew B. Kahng, Ma...
In this paper we address the problem of designing energy minimizing collision-free maneuvers for multiple agents moving on a plane. We show that the problem is equivalent to that o...
Jianghai Hu, Maria Prandini, Karl Henrik Johansson...
Abstract-- In this paper we present a method for automatically generating optimal robot trajectories satisfying high level mission specifications. The motion of the robot in the en...
Stephen L. Smith, Jana Tumova, Calin Belta, Daniel...