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» Path Integral Monte Carlo Simulations and Analytical Approxi...
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DATE
2009
IEEE
113views Hardware» more  DATE 2009»
14 years 2 months ago
New simulation methodology of 3D surface roughness loss for interconnects modeling
— As clock frequencies exceed giga-Hertz, the extra power loss due to conductor surface roughness in interconnects and packagings is more evident and thus demands a proper accou...
Quan Chen, Ngai Wong
DATE
2009
IEEE
113views Hardware» more  DATE 2009»
14 years 2 months ago
System-level process variability analysis and mitigation for 3D MPSoCs
Abstract—While prior research has extensively evaluated the performance advantage of moving from a 2D to a 3D design style, the impact of process parameter variations on 3D desig...
Siddharth Garg, Diana Marculescu