In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit ar...
In this paper we address the problem of matching two images with two different resolutions: a high-resolution image and a low-resolution one. On the premise that changes in resolu...
For various 3D shape analysis tasks, the LaplaceBeltrami(LB) embedding has become increasingly popular as it enables the efficient comparison of shapes based on intrinsic geometry...
Rongjie Lai, Yonggang Shi, Kevin Scheibel, Scott F...
Few works are available in the literature to define similarity criteria between First-Order Logic formulæ, where the presence of relations causes various portions of one descript...
Stefano Ferilli, Teresa Maria Altomare Basile, Nic...
A visual attention system should respond placidly when common stimuli are presented, while at the same time keep alert to anomalous visual inputs. In this paper, a dynamic visual ...