3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
A swap instruction, which exchanges a value in memory with a value of a register, is available on many architectures. The primary application of a swap instruction has been for pro...
Apan Qasem, David B. Whalley, Xin Yuan, Robert van...
As Web Services have matured they have been substantially leveraged within the academic, research and business communities. An exemplar of this is the realignment, last year, of t...
The practical realization of managing and executing large scale scientific computations efficiently and reliably is quite challenging. Scientific computations often invo...
Yong Zhao, Ioan Raicu, Ian T. Foster, Mihael Hateg...
In this paper the behavior of the upcoming MAC protocol for wireless LANs IEEE 802.11e is investigated. Based on the results, we propose an enhancement for Hybrid Coordination Fun...
Balasubramanian Appiah Venkatakrishnan, S. Selvake...