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CODES
2007
IEEE
14 years 2 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
EUROPAR
2001
Springer
14 years 5 days ago
Using a Swap Instruction to Coalesce Loads and Stores
A swap instruction, which exchanges a value in memory with a value of a register, is available on many architectures. The primary application of a swap instruction has been for pro...
Apan Qasem, David B. Whalley, Xin Yuan, Robert van...
ESCIENCE
2005
IEEE
14 years 1 months ago
On the Costs for Reliable Messaging in Web/Grid Service Environments
As Web Services have matured they have been substantially leveraged within the academic, research and business communities. An exemplar of this is the realignment, last year, of t...
Shrideep Pallickara, Geoffrey Fox, Beytullah Yildi...
CORR
2008
Springer
185views Education» more  CORR 2008»
13 years 7 months ago
Realizing Fast, Scalable and Reliable Scientific Computations in Grid Environments
The practical realization of managing and executing large scale scientific computations efficiently and reliably is quite challenging. Scientific computations often invo...
Yong Zhao, Ioan Raicu, Ian T. Foster, Mihael Hateg...
MSWIM
2004
ACM
14 years 1 months ago
An enhanced HCF for IEEE 802.11e wireless networks
In this paper the behavior of the upcoming MAC protocol for wireless LANs IEEE 802.11e is investigated. Based on the results, we propose an enhancement for Hybrid Coordination Fun...
Balasubramanian Appiah Venkatakrishnan, S. Selvake...