33 search results - page 3 / 7 » Performance-aware thermal management via task scheduling |
CODES
2007
IEEE
14 years 1 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
CODES
2008
IEEE
13 years 9 months ago
2008
IEEE
We study the problem of scheduling repetitive real-time tasks with the Earliest Deadline First (EDF) policy that can guarantee the given maximal temperature constraint. We show th...
EUROSYS
2008
ACM
14 years 4 months ago
2008
ACM
Non-uniform utilization of functional units in combination with hardware mechanisms such as clock gating leads to different power consumptions in different parts of a processor ch...
TVLSI
2008
13 years 7 months ago
2008
Thermal hot spots and high temperature gradients degrade reliability and performance, and increase cooling costs and leakage power. In this paper, we explore the benefits of temper...
EUROSYS
2006
ACM
14 years 4 months ago
2006
ACM
Actions usually taken to prevent processors from overheating, such as decreasing the frequency or stopping the execution flow, also degrade performance. Multiprocessor systems, h...