2749 search results - page 116 / 550 » Physical Design of the |
144
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ICCAD
2009
IEEE
15 years 3 months ago
2009
IEEE
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
122
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CHI
2010
ACM
16 years 25 days ago
2010
ACM
This paper presents an exploratory study investigating how physical and digital documents are used in combination on tabletops. Our results identify hybrid piles as the most commo...
158
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HUC
1999
Springer
15 years 10 months ago
1999
Springer
Many novel applications take on the task of moving the personal computer away from the desktop with the approach to merge digital information with physical space and objects. These...
129
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DAC
2005
ACM
16 years 7 months ago
2005
ACM
Since across-chip interconnect delays can exceed a clock cycle in nanometer technologies, it has become essential in high performance designs to add flip-flops on wires with multi...
193
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CSREAESA
2003
15 years 7 months ago
2003
Most so-called “adiabatic” digital logic circuit families reported in the low-power design literature are actually not truly adiabatic, in that they do not satisfy the general...