101 search results - page 9 / 21 » Power Performance Thermal Design-Space Exploration for Multi... |
DAC
2009
ACM
14 years 8 months ago
2009
ACM
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
WH
2010
13 years 2 months ago
2010
Body Sensor Networks (BSNs) consist of sensor nodes deployed on the human body for health monitoring. Each sensor node is implemented by interfacing a physiological sensor with a ...
HPCA
2008
IEEE
14 years 8 months ago
2008
IEEE
Estimating the maximum power and thermal characteristics of a processor is essential for designing its power delivery system, packaging, cooling, and power/thermal management sche...
RTAS
2006
IEEE
14 years 1 months ago
2006
IEEE
Multicore architectures, which have multiple processing units on a single chip, are widely viewed as a way to achieve higher processor performance, given that thermal and power pr...
ISPASS
2007
IEEE
14 years 1 months ago
2007
IEEE
Parameter variation due to manufacturing error will be an unavoidable consequence of technology scaling in future generations. The impact of random variation in physical factors s...